Exhibit at the 1st Highly-Functional Materials Expo (Highly-Functional Material Week 2026 in Tokyo)
Dear Customers and Business Partners,
Thank you very much for your continued support and patronage.
Gun Ei Chemical Industry Co., Ltd. is pleased to announce our participation in the 1st Highly-Functional Materials Expo (held within Highly-Functional Material Week 2026 Tokyo), one of Japan’s largest specialized material exhibitions. The event will take place from Wednesday, September 30 to Friday, October 2, 2026, at Makuhari Messe(Chiba prefecture).
Under the theme of “High-Performance Fibers × Electronic Materials,” we will showcase a comprehensive lineup of products driven by our core technologies. We will present versatile solutions, including various processed forms and application products of our high-performance fiber “Kynol®”, low-dielectric resin “G-LDIA” which contributes to the evolution of next-generation high-speed communications, the “FPP Series” furan polymers balancing low environmental impact with high functionality, and 100% Carbon Materials for 3D Printing.
Exhibition overview
Event Name: 1st Highly-Functional Materials Expo (within Highly-Functional Material Week 2026 in Tokyo)
Official website: Highly-functional Material Week | Advanced Materials Exhibition
Dates: Wednesday, September 30 – Friday, October 2, 2026
10:00 – 18:00 (Closes at 17:00 on the final day)
Venue: Makuhari Messe (Exhibition Halls 1–8)
Address: 2-1 Nakase, Mihama-ku, Chiba-shi, Chiba 261-8550, Japan. Booth Number: 13-44
Exhibition Hours(JST)
September 30 (Wed) 10:00 – 18:00
October 1 (Thu) 10:00 – 18:00
October 2 (Fri) 10:00 – 17:00
Main Exhibits & Highlights
1. High-Performance Fiber: “Kynol®” Series
High-performance phenolic resin-derived fiber featuring outstanding heat, flame, and chemical resistance. In addition to various processed forms such as staple fibers, spun yarns, felts, and fabrics, we will display actual product samples and application case studies across diverse fields, including aerospace, protective clothing, performance-enhancing rubber compounding, water purification, and solvent recovery.
2. Next-Generation High-Speed Communication & Electronic Materials: “G-LDIA” & Polymers for Photosensitive Insulating Films
G-LDIA: A core material combining high adhesion with a low dissipation factor (Low Df), contributing to higher transmission speeds in 5G/6G and automotive communication PCBs.
Polymers for Photosensitive Insulating Films: Combining the key benefits of polyimide and phenol novolac, these polymers achieve low-temperature curing alongside superior heat resistance, high resolution, and high sensitivity.
3. Sustainable & Advanced Development Materials
Furan Polymers “FPP Series”: A biomass resin solution utilizing plant-derived raw materials such as corn, offering excellent heat and chemical resistance.
3D Carbon Materials: Materials made of 100% carbon designed for 3D printers that enable the fabrication of complex, three-dimensional structures using specialized spherical carbon.
We sincerely look forward to welcoming you to our booth.